# |
Requirement |
Description |
1 |
Company Profile |
Company background and domain of expertise. Company size, no. of staffs, presence in Egypt market, no. of offices and locations Company profile, and profiles of technology or manufacturing partners |
2 |
Regional/ International Experience |
International or regional experiences working in other markets |
3 |
Company financial situation – financial statement |
Income statement for last 2 years |
4 |
Previous experience in similar projects |
Submit a company portfolio including previous experiences in similar design project |
5 |
Previous mass production experience of similar products |
Submit a company previous experiences dealing with electronic devices mass manufacturing |
6 |
Customer references |
Reference contacts for company’s customers (name, address, main contact numbers) |
7 |
R&D team |
The company must have a dedicated R&D team. |
8 |
Agreement with chipset |
Submit LOI or MoU with chipset provider (ex. Qualcomm, MTK, Realtek, Maxilinear,…etc.) |
9 |
Time plan for design phase with detailed breakdown and milestones |
Submit nine-months project plan for the design phase, including needed resources, task breakdown and milestones |
10 |
Technical/commercial/legal Requirements |
Adhere to TE technical, commercial, and legal requirements attached in all Requirements available in the Annex in Section 11. |
11 |
Budget estimation & design cost breakdown |
Submit a cost breakdown for all design stages grouped for each and every milestone |
12 |
Estimated production price based on volume tiers |
Submit unit price in case going for mass production based on volume tiers (10K, 50K, 100K, 200K, 500K, 1M) units. |
13 |
Local Manufacturing Plan |
Provide a local manufacturing plan in case of contracting for local mass-production, including pre-agreement with one of local manufacturer (LOI or MOU). |